Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to conductive state
Reexamination Certificate
2008-04-01
2008-04-01
Toledo, Fernando L (Department: 2823)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to conductive state
C438S467000, C438S600000, C257SE23147
Reexamination Certificate
active
10983314
ABSTRACT:
A method of trimming down the volume of a semiconductor resistor element using electrical resistance feedback. After forming conductive material disposed between a pair of electrodes, a voltage is applied to the electrodes to produce an electrical current through the conductive material sufficient to heat and melt away a portion of the conductive material. By reducing the volume of the conductive material, its resistance is increased. The application of the voltage is ceased once the desired dimensions (and thus resistivity) of the conductive material is reached. The resulting semiconductor resistor element could have a fixed resistance, or could have a variable resistance (by using phase change memory material).
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patent: RE37259 (2001-07-01), Ovshinsky
patent: 2006/0137402 (2006-06-01), Eichholz et al.
Chen Bomy
Feng Songlin
Lin Ya-Fen
Song Zhitang
DLA Piper (US) LLP
Silicon Storage Technology, Inc.
Toledo Fernando L
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