Method of treating surfaces of substrates with the aid of a plas

Details Method of treating surfaces of substrates with the aid of a plas Method of treating surfaces of substrates with the aid of a plas

1988-06-13

1989-10-03

Pianalto, Bernard

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 47, B05D 306

Patent

active

048715808

ABSTRACT:
A method of treating substrate surfaces with the aid of a plasma such as etching, deposition etc. In the practice of the method, the plasma flows from its place of generation to the treatment-chamber, and in which method the plasma-generator is flushed through with a flushing gas. Preferably, and firstly after the flushing gas has passed the cathodes, the reactant is fed to the plasma-generator. The invention includes the reactor necessary for carrying out the method.

REFERENCES:
Plasma-Assisted Chemical Vapor Deposition Processes and their Semiconductor Application, Thin Solid Films, 113 (1984) 135-149.
A New Approach of Plasma Deposition, G. M. W. Kroesen et al., ISPC-7 Conference, Jul. 1985, pp. 698-703.
Physics of Plasma Etching and Plasma Deposition, D. C. Schram et al., pp. 181-187, SASP-Proceedings, 1986.

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