Method of treating semiconductor element

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Radiation or energy treatment modifying properties of...

Reexamination Certificate

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C438S197000, C438S308000, C438S473000, C438S535000

Reexamination Certificate

active

08084331

ABSTRACT:
In a method of treating a semiconductor element which at least includes a semiconductor, a threshold voltage of the semiconductor element is changed by irradiating the semiconductor with light with a wavelength longer than an absorption edge wavelength of the semiconductor. The areal density of in-gap states in the semiconductor is 1013cm−2eV−1or less. The band gap may be 2 eV or greater. The semiconductor may include at least one selected from the group consisting of In, Ga, Zn and Sn. The semiconductor may be one selected from the group consisting of amorphous In—Ga—Zn—O (IGZO), amorphous In—Zn—O (IZO) and amorphous Zn—Sn—O (ZTO). The light irradiation may induce the threshold voltage shift in the semiconductor element, the shift being of the opposite sign to the threshold voltage shift caused by manufacturing process history, time-dependent change, electrical stress or thermal stress.

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