Method of treating metal nitride films to reduce silicon migrati

Fishing – trapping – and vermin destroying

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437190, 437192, 427535, H01L 2128

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active

057121931

ABSTRACT:
A method of treating the surface of a metal nitride barrier layer on an integrated circuit to reduce the movement of silicon through the barrier. The metal nitride barrier (such as TiN) is exposed to a nitrogen plasma, thereby improving the barrier properties of the metal nitride barrier.

REFERENCES:
patent: 5232871 (1993-08-01), Ho
patent: 5389575 (1995-02-01), Chin et al.
patent: 5567483 (1996-10-01), Foster et al.
patent: 5593511 (1997-01-01), Foster et al.
Stanley Wolf "Silicon Processing for the VLSI Era, vol. II" Lattice Press, Calif. (1990) pp. 192-193.

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