Method of treating halogenated polyimide substrates for increasi

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener

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427305, 4274431, 205187, 205211, B05D 100

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active

052905977

ABSTRACT:
Method of producing a polyimide layer having improved adhesion to a metal layer thereon. A halogenated polyamic acid is sprayed, partially cured, degreased and oxidized to form a partially cured polyimide layer, which is then electrolessly plated with a primary metal layer and then final cured into the polyimide layer. Electrolessly or electrolytically applied secondary metal layers are then deposited on the primary layer, until the metal layer of a desired thickness is attained. The present invention further discloses articles such as an EMI shielded enclosure and an insulated mold surface, having metal layers as an EMI shield and an insulating surface, respectively.

REFERENCES:
patent: 3011920 (1961-12-01), Shipley, Jr.
patent: 3841881 (1974-10-01), Feldstein et al.
patent: 4111906 (1978-09-01), Jones et al.
patent: 4203922 (1980-05-01), Jones et al.
patent: 4425380 (1984-01-01), Nuzzi
patent: 4515829 (1985-05-01), Decker et al.
patent: 4555315 (1985-11-01), Barbieri et al.
patent: 4842946 (1989-06-01), Foust
patent: 4931310 (1990-06-01), Anschel
patent: 5130192 (1992-07-01), Takabayashi
patent: 5178914 (1993-01-01), Goldblatt
patent: 5183692 (1993-02-01), Mukerji
Kirk-Othmer, Encyclopedia of Chemical Technology, Third Edition, vol. 8-Wiley-Interscience-Wayne A. McRae, Research Ionics, Ind.-Electroless Plating-pp. 738-750.
Kirk-Othmer, Encyclopedia of Chemical Technology, Third Edition, vol. 8-Wiley-Interscience-Nikolaus E. Wolff, Consultant, Hanover, N.H., John W. Weigl, Xerox Corp.-Electroplating-pp. 826-869.
E. I. Monthly No: E18907061713, Thermal Properties of EYMYD Polyimides, R. J. Jones, and E.M. Silvermann-TRW Space & Technology Group, Redondo Beach, Calif.-SAMPE Journal v 25 n 2, Mar.-Apr. 1989, pp. 41-44.

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