Method of treating and probing a via

Details Method of treating and probing a via Method of treating and probing a via

2011-06-07

2011-06-07

King, Roy (Department: 1733)

Metal fusion bonding

Process

Plural joints

C228S104000, C228S103000

Reexamination Certificate

active

07954693

ABSTRACT:
A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including collinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.

REFERENCES:
patent: 5032787 (1991-07-01), Johnston et al.
patent: 5597737 (1997-01-01), Greer et al.
patent: 7025628 (2006-04-01), LaMeres et al.
patent: 7040526 (2006-05-01), Negishi et al.
patent: 7315176 (2008-01-01), Nelson et al.
patent: 2007/0018663 (2007-01-01), Leinbach et al.

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