Method of treating an integrated circuit to provide a temperatur

Details Method of treating an integrated circuit to provide a temperatur Method of treating an integrated circuit to provide a temperatur

1988-07-19

1990-04-17

James, Andrew J.

Fishing, trapping, and vermin destroying

357 28, 357 30, 437 53, 437 51, H01L 1114

Patent

active

049185055

ABSTRACT:
An integrated circuit is formed in a semiconductor die having a front face and a back face, the die having at least first and second functional regions. The first functional region comprises at least one zone of p-type material and at least one zone of n-type material that meets the zone of p-type material in a p-n junction. The integrated circuit comprises connection pads connected respectively to the zone of p-type material and the zone of n-type material, whereby those zones can be connected to an external circuit. At least one of the connection pads is electrically isolated from the second functional region of the integrated circuit. The integrated circuit is treated by mounting the die on a support member and removing material of the die so as to separate the functional regions of the die from each other.

REFERENCES:
patent: 3697786 (1972-10-01), Smith
patent: 4257061 (1981-03-01), Chapel
patent: 4422091 (1983-12-01), Liu
patent: 4739382 (1988-04-01), Blouke
D. Hodges, H. Jackson, "Analysis and Design of Digital Integrated Circuits", McGraw-Hill, 1983, p. 138.

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