Method of treating an integrated circuit

Details Method of treating an integrated circuit Method of treating an integrated circuit

1987-10-29

1990-01-09

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437 68, 437 53, 437209, 437974, H01L 2176, H01L 2182

Patent

active

048928429

ABSTRACT:
An integrated circuit formed in a semiconductor die which has at least two distinct functional regions is treated by mounting the die by way of its front face on a support member, and subsequently removing die material by way of its back face so as to physically separate the functional regions of the die from each other.

REFERENCES:
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patent: 3623219 (1971-11-01), Stoller et al.
patent: 3665263 (1972-05-01), Akyama
patent: 3875657 (1975-04-01), Clarke et al.
patent: 3911559 (1975-10-01), Beam et al.
patent: 4050979 (1977-09-01), Smeltzer et al.
patent: 4106046 (1978-08-01), Nathanson et al.
IBM Technical Disclosure Bulletin, "Method of Evenly Filling Isolation Trenches", J. Greschner, B. F. Hafner and H. J. Trumpp, vol. 27, No. 4A, Sep. 1984.

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