Method of treating an electrodeposited photosensitive resist to

Details Method of treating an electrodeposited photosensitive resist to Method of treating an electrodeposited photosensitive resist to

1993-11-24

1995-12-12

Niebling, John

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

2041806, 205125, 205229, 205920, C25D 548, C25D 1306

Patent

active

054746663

ABSTRACT:
Water spotting which occurs during rinsing of an electrodeposited photosensitive resist composition on a copper layer of a printed circuit board is reduced by applying an aqueous solution containing a surfactant. The surfactant is preferably a salt of an acylated polypeptide which is solid at ambient room temperature and forms a thin uniform film when the solution is dried.

REFERENCES:
patent: 3985722 (1976-10-01), Yoshida et al.
patent: 4732690 (1988-03-01), Shaw
patent: 4832950 (1989-05-01), Takaya et al.
patent: 4898656 (1990-02-01), Hoshino et al.
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 99-105.

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