Method of treating adherent semiconductor particles to break the

Details Method of treating adherent semiconductor particles to break the Method of treating adherent semiconductor particles to break the

1994-01-12

1995-05-09

Eley, Timothy V.

Solid material comminution or disintegration

Processes

By utilizing kinetic energy of projected or suspended material

241 18, B02C 1906

Patent

active

054132851

ABSTRACT:
Adherent silicon spheres (10) are broken apart into separate spheres by entraining them in a high velocity gas stream (12) which is directed at a surface (20). When the adherent spheres (10) impact on the surface (20) they break apart. The gas (12) and the separated spheres (10) are directed away from the surface (20) along divergent paths and the spheres (10) are collected for use.

REFERENCES:
patent: 2768938 (1956-10-01), Martin
patent: 3208950 (1965-09-01), Yocom et al.
patent: 3853274 (1974-12-01), Wright et al.
patent: 4323198 (1982-04-01), Turner et al.
patent: 4354641 (1982-10-01), Smith
patent: 4691866 (1987-09-01), Belk
patent: 5012619 (1991-05-01), Knepprath et al.
patent: 5069740 (1991-12-01), Levine et al.

Affiliated with

Also associated with

Rating

Method of treating adherent semiconductor particles to break the does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of treating adherent semiconductor particles to break the, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of treating adherent semiconductor particles to break the will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1700123