Method of treating a semiconductor body

Details Method of treating a semiconductor body Method of treating a semiconductor body

1989-05-01

1990-05-08

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437213, 357 80, 357 24, H01L 2170, H01L 2160, H01L 2100

Patent

active

049238256

ABSTRACT:
A semiconductor body is treated by providing a layer of dielectric material over a peripheral region of the front face of the body, mounting the body on a support member with the front face of the body in confronting relationship with the support member, and removing material of the body in the peripheral region, so as to expose at least a portion of the layer of dielectric material. A layer of metal is formed on the back face of the body and is connected to an electrical terminal.

REFERENCES:
patent: 4251909 (1981-02-01), Hoeberechts
patent: 4422091 (1983-12-01), Liu
patent: 4716447 (1987-12-01), Savoye

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