Method of treating a hardened semiconductor resin encapsulated l

Details Method of treating a hardened semiconductor resin encapsulated l Method of treating a hardened semiconductor resin encapsulated l

1990-09-10

1991-07-30

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

357 72, H01L 2156

Patent

active

050360248

ABSTRACT:
Semiconductor devices which comprise a semiconductor chip, electrically conductive materials for connections to external leads, and encapsulated by a sealing resin has a surface and a portion of the electrically conductive material covered with a hardened silicone layer whose surface is exposed to ultraviolet radiation and the irradiation processed surface adheres to and is unified with the sealing resin. The sealing resin does not break easily when the device is exposed to heat cycles, thermal shock, repeated interruptions in current flow, and long periods of time at high temperature or low temperature. Such devices also exhibit excellent properties of moisture resistance, corrosion resistance and stress relaxation.

REFERENCES:
patent: 4523371 (1985-06-01), Wakashima
patent: 4707725 (1987-11-01), Ito
patent: 4758875 (1988-07-01), Fujisaki et al.

Affiliated with

Also associated with

Rating

Method of treating a hardened semiconductor resin encapsulated l does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of treating a hardened semiconductor resin encapsulated l, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of treating a hardened semiconductor resin encapsulated l will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1542527