Method of transferring solder balls onto a semiconductor device

Details Method of transferring solder balls onto a semiconductor device Method of transferring solder balls onto a semiconductor device

1991-11-01

1993-06-15

Seidel, Richard K.

Metal fusion bonding

Process

Preplacing solid filler

228 41, 228246, B23K 3514, B23K 3700

Patent

active

052191176

ABSTRACT:
Solder balls are transferred onto a semiconductor device (50), for example a flip chip semiconductor device, without using solder evaporation techniques. In one form, pre-formed solder balls (36) are placed in recesses (32) formed in a transfer substrate (30). A semiconductor die (12) having a plurality of bond pads (14) is positioned with respect to the transfer substrate so that the solder balls are aligned to, and in contact with, the bond pads. The solder balls are then reflowed to form a metallurgical bond to the bond pads. One embodiment of the invention utilizes a transfer substrate made of silicon so that the coefficient of thermal expansion of the transfer substrate will closely match that of the semiconductor die, thereby minimizing solder ball alignment variances. Use of silicon as a transfer substrate material also allows the recesses to easily be made non-wettable by conventional silicon oxidation techniques.

REFERENCES:
patent: 4722470 (1988-02-01), Johary
patent: 4898320 (1990-02-01), Dunaway et al.
"CRC Handbook of Chemistry and Physics," edited by R. C. Weast et al., CRC Press, Inc., Boca Raton, Fla., 60th Edition, 1979, p. D-189.
"Microelectronics Packaging Handbook," edited by R. R. Tummala et al., Van Nostrand Reinhold, New York, 1989, p. 36.
R. J. Herdzik et al., "Tinning Preplated Sites on a Substrate," IBM Tech. Disclosure Bull., vol. 19, No. 8 (Jan. 1977) pp. 3049-3050.
Handbook of Chemistry and Physics, 44th Ed., The Chemical Rubber Publishing Co., Cleveland, Ohio, 1962, pp. 2328-2329.

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