Method of transferring semiconductor chips

Details Method of transferring semiconductor chips Method of transferring semiconductor chips

2005-03-29

2005-03-29

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

Reexamination Certificate

active

06872596

ABSTRACT:
In a method of transferring semiconductor chips from a substantially flat wafer having an active side with a plurality of individual semiconductor chips formed thereon and a support side opposite the active side to a receiver, and the wafer is attached with its support side by way of an adhesive sheet to a support structure and is cut into segments corresponding to the individual semiconductor chips so that the semiconductor chips are individually supported on the adhesive sheet with their active sides exposed and facing away from the adhesive sheet, the support structure is moved with the individual semiconductor chips into a position wherein a particular semiconductor chip to be removed is positioned in a removal location above a receiver and the adhesive sheet is pushed downwardly at the particular semiconductor chip location so as to release the particular semiconductor chip and transfer it with the active side thereof onto the receiver.

REFERENCES:
Derwent abstracted publication JP58222013 “Method for separating plates” Jul. 27, 1984.

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