Method of transferring a wafer

Details Method of transferring a wafer Method of transferring a wafer

2011-03-22

2011-03-22

Eley, Timothy V (Department: 3724)

Abrading

Abrading process

Glass or stone abrading

C451S036000, C451S339000

Reexamination Certificate

active

07909677

ABSTRACT:
A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid.

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patent: 2004/0127142 (2004-07-01), Olgado
patent: 2005/0274393 (2005-12-01), Perng et al.
patent: 2007/0123047 (2007-05-01), Shirasu et al.
patent: 2008/0268753 (2008-10-01), Ishikawa et al.

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