Method of transfer lamination of copper thin sheets and films

Details Method of transfer lamination of copper thin sheets and films Method of transfer lamination of copper thin sheets and films

1983-02-22

1984-06-19

Kimlin, Edward C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156233, 156289, 156300, 156325, 427406, 4274192, 428623, 428658, 428674, 174 685, B32B 1520, B44C 114, B05C 136, B21D 3900

Patent

active

044551819

ABSTRACT:
A copper-clad laminate having special utility in the production of high resolution printed circuit patterns by either subtractive or semi-additive processing is made by vapor depositing a film of zinc on a copper film on a silica-coated aluminum carrier sheet, vapor depositing a silica film on the resulting zinc-copper foil, bonding the resulting body to a substrate and then stripping the silica-coated aluminum carrier sheet from the copper-clad laminate.

REFERENCES:
patent: 2916400 (1959-12-01), Homer et al.
patent: 3237271 (1966-03-01), Arnold et al.
patent: 3857681 (1974-12-01), Yates et al.
patent: 3984598 (1976-10-01), Sarazin et al.
patent: 4049481 (1977-09-01), Morisaki
patent: 4153518 (1979-05-01), Holmes et al.
patent: 4193849 (1980-03-01), Sato
patent: 4215170 (1980-07-01), Oliva
Pellegrino News Item, Electronics Packaging & Production, vol. 18, #11, p. 125, Nov. 1978.
R. H. Doremus et al.,-Growth and Perfection of Crystals, 8-24-29, 1958, Proceedings of an International Conference on Crystal Growth, pp. 26-28.
Arrowsmith, Transactions Inst. of Metal Finishing, vol. 48, p. 88, 1970, "Adhesion of Electroformed Copper and Nickel to Plastic Laminates."

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