Method of thiourea addition of electrolytic solutions useful for

Details Method of thiourea addition of electrolytic solutions useful for Method of thiourea addition of electrolytic solutions useful for

1983-07-19

1984-10-02

Andrews, R. L.

Chemistry: electrical and wave energy

Processes and products

204400, 204108, C25B 1100, C25C 112

Patent

active

044746490

ABSTRACT:
A process for precise controlling of thiourea concentrations in a copper sulfate, sulfuric acid solution used in copper refining has permitted improvements in tankhouse current efficiencies and the quality of the refined copper deposited on the cathodes.

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patent: 2462870 (1949-03-01), Keller
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patent: 2954331 (1960-09-01), Abbot
patent: 3215611 (1965-11-01), Pawlek et al.
patent: 3389064 (1968-06-01), Schloen
patent: 4146437 (1979-03-01), O'Keefe
Schab, Beyer, Schulz and Hein, "The Behavior of Thiourea During Electrolytic Refining of Copper", Friedberger Forsch Metall, 1977.
Extractive Metallurgy of Copper, Ch. 15, pp. 295-323, Biswis & Davenport; Pergamon International Library, 1976.
EG&G Princeton Applied Research, Analytical Instrument Division; Application Note P-2 "Basics of Voltammetry and Polarography".
Princeton Applied Research, Application Brief T-1; "Thiourea and Substituted Thioureas".
"Effects of Addition Agents on the Cathode Polarization Potential During the Electrodep. of Cu" by Shreir et al., Trans. Far. Soc. v. 50, 393-403 (1954).
"The Structure of Electrodeposited Cu Examined by X-Ray Diffract. Techn." by E. M. Hofer et al., J. ECS., Feb. 1965 pp. 167-173.

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