Method of thinning integrated circuits received in die form

Details Method of thinning integrated circuits received in die form Method of thinning integrated circuits received in die form

1997-07-25

2000-01-11

Utech, Benjamin

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438455, 438458, 438459, 438692, H01L 21302, H01L 21463

Patent

active

060135344

ABSTRACT:
A method of thinning integrated circuits in die form including acquiring a handle wafer; depositing an etch stop material on the handle wafer; coating an adhesive layer onto the etch stop material; acquiring a template wafer; cutting an opening through the template wafer; placing dice onto the adhesive layer of the handle wafer; bonding the template wafer onto the handle wafer; filling any gaps with adhesive material; thinning the resulting structure; acquiring a transfer wafer; coating an adhesive layer onto the transfer wafer; bonding the transfer wafer to the resulting structure; removing the handle wafer; removing the etch stop material; removing any remaining adhesive material; testing electrically the thinned dice; recording which of the thinned dice are functional; dicing the transfer wafer into portions; holding temporarily the portions; removing the transfer wafer from the portions; and packaging the thinned dice.

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