Method of thinning a silicon wafer using a reinforcing material

Details Method of thinning a silicon wafer using a reinforcing material Method of thinning a silicon wafer using a reinforcing material

1988-12-27

1990-08-07

Lawrence, Evan

Coating processes

With cutting, holding, severing, or abrading the base

148DIG135, 156662, 4273762, 437227, 437946, 437974, B05D 312, B05D 512

Patent

active

049467166

ABSTRACT:
A plate-like body (e.g., a silicon wafer) at least about 0.5 mm thick that is to be thinned is reinforced by applying to one main surface, in adhesive relationship thereto, a coating of a finely divided material which is fused to form a hard mechanically supportive coating. The body is thinned from the second main surface to a thickness less than about 250 .mu.m. For a silicon body, the mechanically supportive coating comprises at least about 18% silicon.

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patent: 4422091 (1983-12-01), Liu
patent: 4476156 (1984-10-01), Brinker et al.

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