Method of thermosonic wire bonding process for copper...

Details Method of thermosonic wire bonding process for copper... Method of thermosonic wire bonding process for copper...

2005-05-03

2005-05-03

Stoner, Kiley (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S208000

Reexamination Certificate

active

06886735

ABSTRACT:
A method of thermosonic wire bonding process for copper connection in a chip comprises controllable time, controllable temperature, and controllable humidity in an artificial circumstance, which generates copper oxide film on a surface of copper chip. The thickness of the film is in the range of 8050 Å to 8200 Å. Therefore, this invention provides the thermosonic wire bonding process for improvement of efficiency and quality.

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