Method of thermocompression bonding a supporting substrate to a

Details Method of thermocompression bonding a supporting substrate to a Method of thermocompression bonding a supporting substrate to a

1998-05-26

2000-03-28

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562757, 156291, 1563077, 29832, 29840, 257783, H05K 330, B32B 3120

Patent

active

060426829

ABSTRACT:
A supporting substrate for mounting a semiconductor bare chip thereon has a surface provided with electrode pads thereon and bumps on the electrode pads. A sealing resin film is selectively formed on the surface of the supporting substrate, except over the bumps, and further the sealing resin film has at least a thermosetting property. The electrode pads of the above supporting substrate and the bumps of the semiconductor bare chip are bonded by a thermo-compression bonding method whereby the sealing between the supporting substrate and the semiconductor bare chip is simultaneously conducted.

REFERENCES:
patent: 4972250 (1990-11-01), Omori et al.
patent: 5384952 (1995-01-01), Matsui
patent: 5611140 (1997-03-01), Kulesza et al.
patent: 5830563 (1998-11-01), Shimoto et al.

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