Metal fusion bonding – Process – Diffusion type
Patent
1981-09-17
1984-04-24
Godici, Nicholas P.
Metal fusion bonding
Process
Diffusion type
228106, 228219, 228234, B23K 2002, B23K 2014
Patent
active
044443528
ABSTRACT:
A first metal surface of a first article of metal, such as the metalization layer on a silicon semiconductor device, is bonded to an opposing or second metal surface of a second article of metal, such as a "structured copper" strain buffer, using an improved method of thermo-compression diffusion bonding that involves temperature control independent of compressional force control, whereby a superior bond is obtained.
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J. W. Butler and H. H. Glascock, II, "Dual SCR Power Module", Proceedings of the IEEE 1980 National Aerospace and Electronics Conference, NAECON 1980 (Dayton, Ohio, May 20-22, 1980), vol. 2, pp. 598-604.
N. T. Panousis & P. M. Hall, "Thermocompression Bonding of Copper Leads Plated with Thin Gold", 1977 Proceedings of 27th Electronic Components Conference, pp. 220-224.
N. T. Panousis, "Thermocompression Bondability of Bare Copper Leads", 1978 Proceedings of 28th Electronics Components Conference, pp. 380-386.
Glascock, II Homer H.
Webster Harold F.
Bruzga Charles E.
Davis Jr. James C.
General Electric Company
Godici Nicholas P.
Hodak Marc
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