Method of thermally treating semiconductor wafers in furnace and

Details Method of thermally treating semiconductor wafers in furnace and Method of thermally treating semiconductor wafers in furnace and

1990-07-19

1991-08-27

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

29 2501, 29 2502, H01L 21324

Patent

active

050433016

ABSTRACT:
A wafer hanger has a rod member and a supporting member. The rod member is inserted into respective notches formed in semiconductor wafers, and then placed on the supporting member. The wafer hanger holding the wafers is put into a furnace for heat treatment of the wafers. Since the wafers are hung from the rod member, plastic deformation due to the gravity of the wafers is not caused in the wafers.

REFERENCES:
patent: 1515104 (1985-05-01), Lee
patent: 4127969 (1978-12-01), Hoshi et al.
patent: 4317522 (1982-03-01), Garrett
patent: 4566839 (1986-01-01), Butler
patent: 4802842 (1989-02-01), Hirayama

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