Method of thermally coupling a flow tube or like component...

Electric heating – Heating devices – With power supply and voltage or current regulation or...

Reexamination Certificate

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Details

C219S483000, C219S505000, C219S541000, C219S553000, C338S013000, C073S204250, C374S101000

Reexamination Certificate

active

07408133

ABSTRACT:
A method of thermally coupling a flow tube or like component to a thermal sensor comprises bonding the component to the thermal sensor such that thermally conductive portions formed on the component are thermally coupled to corresponding sensing/heating elements disposed on the thermal sensor. The method can be employed to form a capillary mass flow sensor system. Thermally conductive portions, such as metal bands, can be formed on the outer surface of a capillary tube for bonding with corresponding resistive heat sensing and heating elements disposed on the substrate of a micro mass flow sensor. Bonding metal pads can be formed on the sensor surface preparatory to solder bonding the tube metal bands to the resistive sensing and heating elements.

REFERENCES:
patent: 4651564 (1987-03-01), Johnson et al.
patent: 5398549 (1995-03-01), Suzuki
patent: 6794981 (2004-09-01), Padmanabhan et al.
patent: 6964204 (2005-11-01), Clark et al.
patent: 7261824 (2007-08-01), Schlautmann et al.
patent: 1351039 (2003-10-01), None
patent: WO 01/20269 (2001-03-01), None
patent: WO 01/84087 (2001-11-01), None

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