Method of the continuous production of circuit board structures

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156182, 1563074, 1563077, 156324, B32B 3108

Patent

active

049666428

ABSTRACT:
To avoid distortion of metal strips flanking the glass fiber resin layers in a system for fabricating circuit board structures in a continuous press, the metal foil webs are bonded to glass fiber webs before the layers are introduced into the mouth of the continuous press and only in the mouth do composite layers meet additional glass fiber and resin layers.

REFERENCES:
patent: 4407883 (1983-10-01), Newton
patent: 4543145 (1985-09-01), Schnell et al.
patent: 4579612 (1986-04-01), Held
patent: 4659425 (1987-04-01), Eggers et al.
patent: 4670080 (1987-08-01), Schwarz et al.
patent: 4690721 (1987-09-01), Schermutzki
Herbert Bruch et al., Handbuch der Leiterplattentechnik, Eugen G. Leuze Verlag, D-7968 Saulgau/Wurtt., Zweite Auflage, ISBN 3-87480-005-9.

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