Method of testing wire bonds for defects using a magnetic field

Details Method of testing wire bonds for defects using a magnetic field Method of testing wire bonds for defects using a magnetic field

1985-10-31

1987-06-30

Eisenzopf, Reinhard J.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

Frequency of cyclic current or voltage

29574, 73827, 324158R, G01R 3126, G01R 3104

Patent

active

046773703

ABSTRACT:
In an integrated circuit package of the type in which multiple conductors are bonded between an integrated circuit chip and the body of the package, wire bonds are tested for defects by a method which includes the steps of: placing the integrated circuit package in a magnetic field; generating respective currents through the conductors while the package is in the field to thereupon induce a magnetic force; and monitoring the current through the conductors to determine if a bond breaks under the force and causes the current through it to stop.

REFERENCES:
patent: 3572108 (1971-03-01), McShane et al.
patent: 3825819 (1974-07-01), Hansen et al.
Krongelb, S., "Electromagnetic Tensile Adhesion Test Method", Conference: Adhesion Measurement of Thin Films, Thick Films and Bulk Coatings, Philadelphia, Pa., Nov. 1976, pp. 107-121.

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