Method of testing semiconductor chips with reusable test package

Details Method of testing semiconductor chips with reusable test package Method of testing semiconductor chips with reusable test package

1993-10-28

1995-10-10

Ramsey, Kenneth J.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228116, 22818022, 324754, H01L 2166

Patent

active

054564042

ABSTRACT:
A method for testing semiconductor chips using a test package having electrical contacts which have in them metallized particles which pierce the surface of the pads of a semiconductor chip, the chips being mounted on a flexible substrate which can deflect to increase the uniformity of the level to which the metallized particles pierce the surface of the pads of the semiconductor chip. If the chip tests as "good", pressure can be applied to increase the piercing depth, thereby allowing the test package to be used as a permanent package.

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