Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent
1997-04-15
1999-12-07
Booth, Richard A
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
428601, 428620, 324754, 324762, 2281791, G01R 3126, H01L 2166
Patent
active
059982284
ABSTRACT:
Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.
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Eldridge Benjamin N.
Grube Gary W.
Khandros Igor Y.
Mathieu Gaetan L.
Booth Richard A
Form Factor, Inc.
Larwood David
Linden Gerald
Murphy John
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