Method of testing plastic-packaged semiconductor devices

Details Method of testing plastic-packaged semiconductor devices Method of testing plastic-packaged semiconductor devices

1983-11-04

1986-02-18

Swisher, S. Clement

Thermal measuring and testing

Thermal testing of a nonthermal quantity

Of susceptibility to thermally induced deteriouration, flaw,...

73432SD, G01N 1300

Patent

active

045710937

ABSTRACT:
The method of testing the moisture ingression rate of semiconductor devices encapsulated in plastic packages comprising first treating the devices in a pressure cooker at elevated temperature and immediately thereafter treating said devices in an 85.degree. C. temperature and 85% humidity atmosphere for a time.

REFERENCES:
patent: 3913217 (1975-10-01), Misawa et al.
patent: 3996602 (1976-12-01), Goldberg et al.
patent: 4001872 (1977-01-01), Khajezadeh
patent: 4248920 (1981-02-01), Yoshizumi et al.
patent: 4365264 (1982-12-01), Mukai et al.

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