Method of testing circuit elements on a semiconductor wafer

Details Method of testing circuit elements on a semiconductor wafer Method of testing circuit elements on a semiconductor wafer

2007-04-19

2009-12-29

Hollington, Jermele M (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C438S017000

Reexamination Certificate

active

07639027

ABSTRACT:
A semiconductor device test apparatus according to the present invention includes a circuit board103and a film105. A plurality of electrodes103care formed at the circuit board103at positions that face opposite a plurality of electrodes201aat a device to be measured201, whereas bumps105bare formed at the surface of the film105located toward the device to be measured201, at positions that face opposite the plurality of electrodes201aat the device to be measured201and electrodes105care formed at the surface of the film105located toward the circuit board103at positions that face opposite the plurality of electrodes103cat the circuit board103. The bumps105bformed at one surface of the film105and the electrodes105cformed at another surface of the film105are electrically connected with each other via through holes105dto support semiconductor devices having electrodes provided at a fine pitch and to improve durability.

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Foreign Office Action issued on Oct. 16, 2007 in the corresponding JP application 2004-148969 with an English translation.

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