Method of testing a semiconductor chip

Details Method of testing a semiconductor chip Method of testing a semiconductor chip

1990-12-11

1992-06-30

Nguyen, Vinh

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324731, 324158R, 21912185, G01R 3126, B23K 2600

Patent

active

051266628

ABSTRACT:
The electrical characteristics of a semiconductor chip having a wiring layer covered with a passivation film are tested by a prober with a probe. First, part of the wiring layer, which is to be electrically connected to the probe, is selected. An opening is then formed by a laser beam in the passivation film, which corresponds to the part of the wiring layer, so as to reach down to a surface of the part of the wiring layer, and thus the part of the wiring layer is exposed. The wavelength of the laser beam is 0.7 .mu.m or less and supplied as a pulse. The depth of the opening is controlled by the number of pulses. Next the probe is inserted into the opening to bring it into electrical contact with the part of the wiring layer. In this manner, the electrical characteristics of the semiconductor chip are tested.

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patent: 4906491 (1990-03-01), Yamazaki
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patent: 4978923 (1990-12-01), Maltiel

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