Method of testing a bond interface

Details Method of testing a bond interface Method of testing a bond interface

1999-09-15

2000-07-25

Noori, Max

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

73827, G01N 300

Patent

active

060924276

ABSTRACT:
A method of preparing and testing bond interface evaluation samples is provided for evaluating the strength of bonds between two metal components, such as the bond in a sputter target/backing plate assembly. A sample of the bond interface of the composite material is removed, a through hole is formed at one end, and the bond interface is removed in the area of the hole, thereby splitting the hole into two holes. The holes are grasped, such as by tapping the holes and inserting threaded rods therein, and the composite layers are pulled apart by applying oppositely directed forces to the rods. The strength of the bond, and not the component materials, is thereby evaluated.

REFERENCES:
patent: 3538757 (1970-11-01), Osborne
patent: 4027529 (1977-06-01), Olsen
patent: 4550613 (1985-11-01), Lehtikoski et al.
patent: 5181424 (1993-01-01), Martin et al.
patent: 5673586 (1997-10-01), Mann

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