Method of testing a ball grid array IC

Details Method of testing a ball grid array IC Method of testing a ball grid array IC

1998-07-30

2000-09-19

Elms, Richard

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438 14, H01L 2166, G01R 3126

Patent

active

061210633

ABSTRACT:
A method of testing a ball grid array (BGA) integrated circuit (IC) package such that no solder balls are attached to the BGA IC package when burn-in testing using a burn-in testing socket is carried out. In this method, landings on the substrate of the BGA IC package directly contact the test contacts of the burn-in testing socket. Furthermore, the substrate of the BGA IC package is cleaned with hydrogen peroxide solution before solder balls are attached onto the landings of the BGA IC substrate.

REFERENCES:
patent: 5807493 (1998-09-01), Maki et al.
patent: 5998228 (1999-12-01), Eldridge et al.
Electronic Packaging and Interconnection Handbook; Charles A. Harper; 1997;pp 10.22-10.33.

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