Metal fusion bonding – Process – Using bond inhibiting separating material
Patent
1984-11-08
1986-08-26
Godici, Nicholas P.
Metal fusion bonding
Process
Using bond inhibiting separating material
228191, 228215, 228212, B23K 120
Patent
active
046077804
ABSTRACT:
A method is provided of temporary assembling by soldering of peel off plates through soldering material and a flexible junction element for a mechanical release device to release two parts temporarily fixed edgewise by peeling off the flexible element and the soldering material. There is provided on the plates and flexible junction element reserved areas without any adherence to the soldering material, and preferably at the limits of said reserved areas, a recess for removing any excess of soldering material, and the melting solder material is put under load for distributing it between the plates and the flexible junction element. A so obtained assembly can be applied particularly to obtain automatic opening of containers in particular in space for spreading out solar panels.
REFERENCES:
patent: 1257502 (1918-02-01), Leighton
patent: 2047686 (1936-07-01), Hodgson
patent: 2329328 (1943-09-01), Bogner
patent: 2479325 (1949-08-01), Domenico
patent: 3249910 (1966-05-01), Venn et al.
patent: 4394953 (1983-07-01), Sonnweber et al.
patent: 4426053 (1984-01-01), Chenin et al.
patent: 4428523 (1984-01-01), Snitzer et al.
Godici Nicholas P.
Heinrich Samuel M.
Societe Nationale Industrielle Aerospatiale
LandOfFree
Method of temporary solder assembling of releasable plates for m does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of temporary solder assembling of releasable plates for m, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of temporary solder assembling of releasable plates for m will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2308095