Method of teaching eyepoints for wire bonding and related...

Metal fusion bonding – Process – Plural joints

Reexamination Certificate

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C228S004500, C228S904000, C219S056000, C219S056100, C219S085180

Reexamination Certificate

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07931186

ABSTRACT:
A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

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Kulicke & Soffa Industries, Inc., Willow Grove, PA 19090; Model 1488 Plus, Automatic Gold Ball Bonder; vol. 1: Operation Manual, Software Version 7.xx; Oct. 1996; pp. 5-1 through 5-22.
International Search Report dated Mar. 19, 2008, International Application No. PCT/US2007/063850.

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