Method of surface preparation and imaging for integrated...

Details Method of surface preparation and imaging for integrated... Method of surface preparation and imaging for integrated...

2007-02-27

2007-02-27

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

C438S016000, C438S459000

Reexamination Certificate

active

10943826

ABSTRACT:
The present invention is a method of surface preparation and imaging for integrated circuits. First, a substrate is selected and an opening is cut in the substrate of a sufficient size to fit an integrated circuit to be analyzed. A second substrate is then selected. An adhesive film is applied to the top surface of the first substrate, the adhesive film having adhesive on both sides and covering the opening on the first substrate. An integrated circuit is then inserted into the opening and attached to the bottom side of the adhesive film. Next, the first substrate and integrated circuit are bonded to the second substrate using the adhesive film. The bottom side of the first substrate and the integrated circuit are then thinned until the substrate wafer of the integrated circuit is completely removed. Finally, an analytical imaging technique is performed on the integrated circuit from the bottom side of the first substrate.

REFERENCES:
patent: 6107107 (2000-08-01), Bruce et al.
patent: 6168965 (2001-01-01), Malinovich et al.
patent: 6225626 (2001-05-01), Talbot et al.
patent: 6329212 (2001-12-01), Dobrovolski
patent: 6338974 (2002-01-01), Strnad
patent: 6921719 (2005-07-01), Paterson et al.

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