Etching a substrate: processes – Nongaseous phase etching of substrate – Relative movement between the substrate and a confined pool...
Patent
1997-11-20
2000-07-25
Cain, Edward J.
Etching a substrate: processes
Nongaseous phase etching of substrate
Relative movement between the substrate and a confined pool...
216 92, 216105, 216106, B44C 122
Patent
active
060933356
ABSTRACT:
A method for planarizing an exposed metal surface on a substrate is provided in which surface irregularities are eliminated. A photoresist layer is first removed from the substrate. Then a conformal planarizing head is placed in contact with the metal surface while chemical etchant essentially free of abrasives is supplied to an interface between the metal substrate and the planarizing head. The surface is then planarized until it is free of irregularties.
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Bhatt Ashwinkumar C.
Camp John Christopher
Desai Subahu Dhirubhai
Markovich Voya Rista
Wozniak Michael
Cain Edward J.
Hogg William N.
International Business Machines - Corporation
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