Method of surface-contacting electronic components

Details Method of surface-contacting electronic components Method of surface-contacting electronic components

1996-03-29

1998-07-28

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

22818022, A05K 334

Patent

active

057852340

ABSTRACT:
A method of joining an electronic component (10) provided with contact surfaces (12) to a substrate (11) comprising contact surfaces (14) via contact metal coatings (16, 17) formed between the contact surfaces and made of a solderable or weldable joining material (15), the electronic component and the substrate being pressed together and heated, and during the joining operation a layer (18) of a medium (19) containing a polyalcohol is disposed at least between the joining material (15) and the contact surfaces (12) of the electronic component (10) or the substrate (11).

REFERENCES:
patent: 5150832 (1992-09-01), Degani et al.
patent: 5177134 (1993-01-01), Mullen, III et al.
patent: 5281281 (1994-01-01), Stefanowski
Patent Abstracts of Japan, vol. 015, No. 502 (E-1147), Dec. 18, 1991; JP-3-218645, Sep. 26, 1991.
International Search Report PCT/DE96/00495, Jul. 9, 1996.
Patent Abstracts of Japan, E-1465, Nov. 26, 1993, vol. 17, No. 640, JA-206220 (13 Aug. 1993).
Patent Abstracts of Japan, E-1136, Nov. 21, 1991, vol. 15, No. 459, JA-196650 (28 Aug. 1991).

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