Method of suppressing overflowing of an encapsulation resin...

Details Method of suppressing overflowing of an encapsulation resin... Method of suppressing overflowing of an encapsulation resin...

2011-06-07

2011-06-07

Chambliss, Alonzo (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S599000, C257S773000, C257S787000

Reexamination Certificate

active

07955903

ABSTRACT:
A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending from the wiring pattern along an outer edge of a solder resist pattern at an outside of the outer edge of the solder resist pattern.

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