Method of supporting wafer, wafer supporting apparatus and wafer

Details Method of supporting wafer, wafer supporting apparatus and wafer Method of supporting wafer, wafer supporting apparatus and wafer

1991-11-22

1994-01-25

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

269 21, 279 3, B32B 3104

Patent

active

052812979

ABSTRACT:
A method of supporting a wafer comprising the steps of: dividing a pressure space formed between the table plate and the wafer into a first pressure space and a second pressure space by means of a pressure setting wall, setting a supporting pressure of a compressed air supplied to the first pressure space, by a throttle function of a throttle passage formed between a pressure regulating wall and the wafer, and determining a further supporting pressure of the compressed air supplied from the first pressure space to the second pressure space through the throttle passage, by a throttle function of a throttle opening for connecting the second pressure space with the atmosphere. A wafer supporting apparatus for carrying out the method and a wafer mounter having the apparatus.

REFERENCES:
patent: 3955163 (1976-05-01), Novak
patent: 4603466 (1986-08-01), Morley
patent: 4696712 (1987-09-01), Nonaka
patent: 5033538 (1991-07-01), Wagner et al.
patent: 5171398 (1992-12-01), Miyamoto

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