Method of supporting a substrate film

Details Method of supporting a substrate film Method of supporting a substrate film

2005-05-24

2005-05-24

Kielin, Erik (Department: 2827)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S110000, C438S111000, C438S107000, C257S667000, C257S670000

Reexamination Certificate

active

06897092

ABSTRACT:
The invention relates to a carrier for supporting a substrate film during the chip-substrate assembly and bonding process. The carrier provides enhanced rigidity to the substrate film. The degree of rigidity and/or flexibility provided can be controlled by selection of the carrier dimensions, configuration and material choice. Advantages of embodiments of the carrier include easier handling, reduced probability of defective end products, and increased control in choosing the thinness of the substrate film. For example, the substrate film carrier can be used for lead-over-chip (LOC) assemblies and lead-under-chip (LUC) assemblies to create ball grid arrays (BGA), pin grid arrays (PGA), dual in-line packages (DIP), and the like.

REFERENCES:
patent: 511935 (1894-01-01), Criswell
patent: 3774232 (1973-11-01), May
patent: 3942245 (1976-03-01), Jackson et al.
patent: 4878991 (1989-11-01), Eichelberger et al.
patent: 5023202 (1991-06-01), Long et al.
patent: 5075760 (1991-12-01), Nakashima et al.
patent: 5111935 (1992-05-01), Bond et al.
patent: 5170328 (1992-12-01), Kruppa
patent: 5173766 (1992-12-01), Long et al.
patent: 5196725 (1993-03-01), Mita et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5286679 (1994-02-01), Farnsworth et al.
patent: 5359222 (1994-10-01), Okutomo et al.
patent: 5472085 (1995-12-01), Gelzer
patent: 5474957 (1995-12-01), Urushima
patent: 5545922 (1996-08-01), Golwalkar et al.
patent: 5585600 (1996-12-01), Froebel et al.
patent: 5661086 (1997-08-01), Nakashima et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5726491 (1998-03-01), Tajima et al.
patent: 5756377 (1998-06-01), Ohsawa
patent: 5789820 (1998-08-01), Yamashita
patent: 5796586 (1998-08-01), Lee et al.
patent: 5841194 (1998-11-01), Tsukamoto
patent: 5844168 (1998-12-01), Schueller et al.
patent: 5847445 (1998-12-01), Wark et al.
patent: 5898214 (1999-04-01), Miura
patent: 5925926 (1999-07-01), Watanabe
patent: 5945834 (1999-08-01), Nakata et al.
patent: 5951804 (1999-09-01), Kweon et al.
patent: 5952711 (1999-09-01), Wohlin et al.
patent: 5977617 (1999-11-01), Kata
patent: 5980683 (1999-11-01), Beck et al.
patent: 6013946 (2000-01-01), Lee et al.
patent: 6036173 (2000-03-01), Neu et al.
patent: 6057174 (2000-05-01), Hashimoto
patent: 6087202 (2000-07-01), Exposito et al.
patent: 6091140 (2000-07-01), Toh et al.
patent: 6097098 (2000-08-01), Ball
patent: 6111324 (2000-08-01), Sheppard et al.
patent: 6118183 (2000-09-01), Umehara et al.
patent: 6144102 (2000-11-01), Amagai
patent: 6179127 (2001-01-01), Kato et al.
patent: 6199743 (2001-03-01), Bettinger et al.
patent: 6240632 (2001-06-01), Ito et al.
patent: 6249046 (2001-06-01), Hashimoto
patent: 6256762 (2001-07-01), Beppu
patent: 6258621 (2001-07-01), Ohuchi et al.
patent: 6268646 (2001-07-01), Sugimoto et al.
patent: 6284569 (2001-09-01), Sheppard et al.
patent: 6303219 (2001-10-01), Sawamura et al.
patent: 6306687 (2001-10-01), Corisis et al.
patent: 6319354 (2001-11-01), Farnworth et al.
patent: 6323541 (2001-11-01), Huang et al.
patent: 6353268 (2002-03-01), Cobbley et al.
patent: 6362637 (2002-03-01), Farnworth et al.
patent: 6379745 (2002-04-01), Kyod et al.
patent: 6426548 (2002-07-01), Mita et al.
patent: 6455354 (2002-09-01), Jiang
patent: 6465876 (2002-10-01), Kitano et al.
patent: 6670696 (2003-12-01), Toyosawa et al.
patent: 20020033524 (2002-03-01), Toyosawa et al.
patent: 358074064 (1983-05-01), None
patent: 58-178544 (1983-10-01), None
patent: 60-46059 (1985-03-01), None
patent: 6-177315 (1994-06-01), None
patent: 11-176886 (1999-07-01), None
patent: 11-274348 (1999-11-01), None
patent: 11-180291 (2001-01-01), None
Harris Semiconductor, “Lexicon—B.” (http://rel.semi.harris.com/docs/lexicon/B.htm), 4 pages, Mar. 2, 1999.
Harris Semiconductor, “Lexicon—C.” (http://rel.semi.harris.com/docs/lexicon/C.htm), 8 pages, Apr. 17, 1999.
Harris Semiconductor, “Lexicon—E.” (http://rel.semi.harris.com/docs/lexicon/E.htm), 3 pages, Apr. 17, 1999.
Harris Semiconductor, “Lexicon—I.” (http://rel.semi.harris.com/docs/lexicon/I.htm), 3 pages, Apr. 17, 1999.
Harris Semiconductor, “Lexicon—P.” (http://rel.semi.harris.com/docs/lexicon/P.htm), 5 pages, Feb. 25, 1999.
Harris Semiconductor, “Lexicon—S.” (http://rel.semi.harris.com/docs/lexicon/S.htm), 10 pages, Apr. 17, 1999.
Harris Semiconductor, “Lexicon—W.” (http://rel.semi.harris.com/docs/lexicon/B.htm), 1 page, Mar. 2, 1999.

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