Method of stripping resists from substrates using hydroxylamine

Details Method of stripping resists from substrates using hydroxylamine Method of stripping resists from substrates using hydroxylamine

1993-10-28

1995-01-17

Lieberman, Paul

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 38, 134 40, 134 42, 430258, C23G 5036, B08B 700, G03C 1112

Patent

active

053818075

ABSTRACT:
A stripping composition for removing resists from substrates containing hydroxylamine and at least one alkanolamine is described. Optionally, one or more polar solvents can also be included in the stripping composition. The stripping composition is especially suitable for removing a photoresist from a substrate during the manufacture of semiconductor integrated circuits and for removing cured polymer coatings, such as polyimide coatings.

REFERENCES:
patent: 4824763 (1989-04-01), Lee
patent: 4873136 (1989-10-01), Foust et al.

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