Method of stripping off wafer-protective sheet

Details Method of stripping off wafer-protective sheet Method of stripping off wafer-protective sheet

1992-01-23

1993-10-19

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, B32B 3500

Patent

active

052542017

ABSTRACT:
A method of stripping off a wafer-protective sheet which comprises bonding an electrically conductive continuousform stripping tape comprising a flexible substrate to, through a pressure-sensitive adhesive layer, an electrically conductive protective sheet applied to a semiconductor wafer on its side where a circuit pattern has been formed, and then peeling the stripping tape from the semiconductor wafer thereby to strip the protective sheet from the semiconductor wafer, said bonding and peeling of the stripping tape being conducted automatically by means of an automatic stripping system while the protective sheet is kept being grounded through the stripping tape.

REFERENCES:
patent: 4111724 (1978-09-01), Ogiue et al.
patent: 4285759 (1981-08-01), Allen et al.
patent: 4631103 (1986-12-01), Ametani
patent: 4775438 (1988-10-01), Funakoshi et al.
patent: 4861411 (1989-08-01), Tezuka
patent: 5006190 (1991-04-01), Earle
patent: 5009735 (1991-04-01), Ametani et al.

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