Method of stretching solder joints

Details Method of stretching solder joints Method of stretching solder joints

1994-01-13

1995-08-15

Rosenbaum, Mark

Metal fusion bonding

Process

Plural joints

228212, 228254, 29840, B23K 100, B23K 3704

Patent

active

054411955

ABSTRACT:
A method of stretching solder joints between the input/output pads of an electrical component and corresponding input/output pads on a substrate includes the steps of: melting the solder joints; confining the component while the solder joints are melted such that the component can only move substantially perpendicular to the substrate; pulling the component, while the component is confined, by an external force in a direction away from the substrate to thereby stretch the melted solder joints; compelling the movement of the component to stop when the component has moved a predetermined distance; and, solidifying the solder joints while the component is compelled to stop. By stretching the solder joints with the above method, the solder joint shape can be changed from convex to concave; and thermally induced stress/strain in the joint is substantially reduced.

REFERENCES:
patent: 3486223 (1969-12-01), Butera
patent: 3921285 (1975-11-01), Krall
L. F. Miller, IBM Tech. Discl. Bull., vol. 10, No. 11 (Apr. 1968) p. 1670.
J. M. Dalbo et al., IBM Tech. Discl. Bull., vol. 27, No. 3 (Aug. 1984) p. 1579.
IBM Tech. Discl. Bull., vol. 28, No. 10 (Mar. 1986) pp. 4337-4338.
IBM Tech. Discl. Bull., vol. 29, No. 12 (May 1987) pp. 5213-5214.

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