Method of standardizing and stabilizing semiconductor wafers

Details Method of standardizing and stabilizing semiconductor wafers Method of standardizing and stabilizing semiconductor wafers

1985-06-10

1987-01-20

Hearn, Brian E.

Metal working

Plural diverse manufacturing apparatus including means for...

Common reciprocating support for spaced tools

148 15, 148DIG24, 148DIG60, 148DIG127, H01L 2102, H01L 21477

Patent

active

046371230

ABSTRACT:
Disclosed is a method of stabilizing and standardizing semiconductor wafers obtained from a plurality of vendor sources for use in both unipolar and bipolar device manufacturing lines. Based on measured initial oxygen concentration, the as-received wafers are grouped into lots. Next, based on measured oxygen precipitation rate of each lot, the wafer lots are grouped into classes, regardless of their vendor origin. Typically, the grouping consists of three classes corresponding to low, intermediate and high oxgen precipitation rate.
The wafers of each class are then subjected to a thermal adaptation cycle tailored to the class to generate in each wafer clusters of a concentration corresponding to a predetermined cluster concentration range and a defect-free zone corresponding to a predetermined defect-free zone range. The thermal adaptation cycle is different from class to class, but identical for wafers of a given class.

REFERENCES:
patent: 4314595 (1982-02-01), Yamamoto et al.
patent: 4342616 (1982-08-01), Elliott et al.
patent: 4344815 (1982-08-01), Cazarra et al.
patent: 4417943 (1983-11-01), Jacques et al.

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