Method of stacking semiconductor substrates for fabrication of t

Details Method of stacking semiconductor substrates for fabrication of t Method of stacking semiconductor substrates for fabrication of t

1990-07-11

1992-02-11

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437915, 437974, H01L 2198

Patent

active

050875850

ABSTRACT:
A semiconductor substrate stacking method comprises the steps of preparing first and second thin film devices each in the form of a thin film having a connection electrode formed on an upper surface thereof and a connection electrode formed on an undersurface thereof, each of the thin film devices being bonded at its upper surface thereof to a support plate by adhesive. The first thin film device is stacked and bonded onto a base substrate having a device formed thereon and a connection electrode formed on the device, in such a manner that the device formed on the base substrate faces the undersurface of the first thin film device and the connection electrode formed on the device formed on the base substrate is in alignment with and in contact with the undersurface connection electrode formed on the first thin film device. The support plate and the adhesive of the first thin film device are removed so that the upper surface of the first thin film device and the upper surface connection electrode formed on the upper surface of the first thin film device are exposed. Similarly, the second thin film device is stacked and bonded onto the first thin film device stacked on the base substrate and the support plate and the adhesive of the second thin film device is removed.

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