Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-07-09
2011-10-18
Daniels, Matthew (Department: 1746)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S247000, C174S254000
Reexamination Certificate
active
08038820
ABSTRACT:
A method of stacking a flexible substrate is provided. The method includes the steps of: preparing a carrier substrate; stacking an adhesive layer on the carrier substrate; and stacking a flexible substrate having at least one image display device on the adhesive layer using a laminating or pressing method. Thus, the flexible substrate is easily fabricated without modification of conventional mass-production equipment for fabricating a display, and thereby a lightweight, thin, and compact flexible display can be realized.
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Korean Notice of Patent Grant dated Mar. 28, 2008 for the corresponding application KR 10-2006-0082746.
Kim Chul Am
Kim Gi Heon
Kim Yong Hae
Park Dong Jin
Suh Kyung Soo
Daniels Matthew
Dodds Scott W
Electronics and Telecommunications Research Institute
Ladas & Parry LLP
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