Method of stacking chips with a removable connecting layer

Details Method of stacking chips with a removable connecting layer Method of stacking chips with a removable connecting layer

1998-08-28

2000-03-21

Monin, Jr., Donald L.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438458, 438464, 257686, 257777, H01L 2310

Patent

active

060402040

ABSTRACT:
A method for manufacturing chip stacks in which wafers are stacked one on top of the other. The wafer is provided with an adhesive foil on its bottom, and is subsequently cut into chips so that the adhesive foil remains intact and the chips adhering to the adhesive foil are stacked one on top of the other. A first layer of chips is reversibly attached to a baseplate, the adhesive foil is removed, the next layer of chips is attached to the bottom side of the chips already fastened to the baseplate, the adhesive foil is removed, and the last two steps are repeated until the desired number of chips is stacked one on top of the other.

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patent: 5824177 (1998-10-01), Yoshihara et al.
patent: 5953588 (1999-09-01), Camien et al.

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