Method of stabilizing material layer

Details Method of stabilizing material layer Method of stabilizing material layer

2005-07-19

2005-07-19

Meeks, Timothy (Department: 1762)

Coating processes

Coating by vapor, gas, or smoke

Mixture of vapors or gases utilized

C427S255370, C427S255392, C427S255394, C427S255500, C438S680000

Reexamination Certificate

active

06919102

ABSTRACT:
A method of stabilizing the properties of a material layer is disclosed. A plurality of wafers are stored in a FOUP and in sequence the wafers are transferred to a chamber to proceed with deposition of a material layer and to the FOUP filled with a specific gas after deposition until all the wafers in the FOUP are treated. In the process of deposition, the wafers deposited with material layers on their surfaces are stored in the FOUP filled with specific gas. Therefore, the surface properties of all the wafers in the FOUP are stablilized and contamination due to outgassing is prevented.

REFERENCES:
patent: 5851921 (1998-12-01), Gardner et al.
patent: 5988233 (1999-11-01), Fosnight et al.
patent: 6187631 (2001-02-01), Harshfield
patent: 6191018 (2001-02-01), Yue et al.
patent: 6448655 (2002-09-01), Babich et al.
patent: 6716651 (2004-04-01), Weng et al.
patent: 2002/0187631 (2002-12-01), Kim et al.
patent: 2004/0182472 (2004-09-01), Aggarwal
patent: 313149 (1997-08-01), None
patent: 396555 (2000-07-01), None

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