Method of sputter etching a surface

Details Method of sputter etching a surface Method of sputter etching a surface

1982-02-26

1984-02-14

Demers, Arthur P.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

204192R, 204298, C23C 1500

Patent

active

044314990

ABSTRACT:
The surface of a target is textured by co-sputter etching the target surface with a seed material adjacent thereto, while the target surface is maintained at a pre-selected temperature. By pre-selecting the temperature of the surface while sputter etching, it is possible to predetermine the reflectance properties of the etched surface. The surface may be textured to absorb sunlight efficiently and have minimal emittance in the infrared region so as to be well-suited for use as a solar absorber for photothermal energy conversion.

REFERENCES:
patent: 4064030 (1977-12-01), Nakai et al.
patent: 4114983 (1978-09-01), Maffitt et al.
patent: 4160045 (1979-07-01), Longshore
patent: 4229233 (1980-10-01), Hansen et al.
Harding et al., Solar Energy Materials 5(1981) pp. 445-464.
Auciello J. Vac. Sci. Technol. 19(1981) pp. 841-867.
Gittleman et al. Appl. Phys. Lett. 35(1979) pp. 742-744.
Craighead et al. Appl. Phys. Lett. 37(1980) pp. 653-656.

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